AMD's Zen 7 "Grimlock" processors, expected to be released in 2028, have seen their first details emerge. The new generation may utilize TSMC's 1.4nm A14 process.
AMD might be starting preparations for the next generation even before releasing its Zen 6 architecture. According to new information, the company's Zen 7-based processors, codenamed "Grimlock", will be developed using TSMC's next-generation A14 manufacturing process.
First Details for Zen 7 Emerge
According to a report shared by Taiwan-based Commercial Times, Zen 7 processors will utilize TSMC's 1.4nm-class A14 manufacturing technology. This process technology is expected to enter mass production in 2028.
Furthermore, the 1.4nm A14 process is said to directly compete with Intel's 14A manufacturing process. Especially with the recent interest from major customers in Intel Foundry services, the semiconductor race has intensified. The report also states that AMD CEO Lisa Su recently met with Powertech during her visit to Taiwan.
It is also rumored that AMD is evaluating Powertech's FOPLP (Fan-Out Panel-Level Packaging) technology for its new generation processors. This method aims to offer higher efficiency and more advanced chip packaging solutions. According to leaks, the Zen 7 "Grimlock" architecture will feature an entirely new CCD design.
The processors are rumored to feature up to 16 cores per chip and offer up to 224 MB of L3 cache on a single CCD with next-generation 3D V-Cache technology. This implies a significant increase in both standard L3 cache amount and 3D V-Cache capacity in the future. On the server side, Zen 7 cores will offer an updated MATRIX engine and support for new AI data formats.
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